Job Summary:
- The Package Development Engineer is responsible for developing, optimizing, and sustaining advanced packaging processes, specifically focusing on wafer saw and laser grooving process technologies. This role involves collaboration with cross-functional teams to ensure high-quality and efficient manufacturing processes for semiconductor devices.
Responsibilities:
- Lead R&D initiatives focused on die preparation processes like but not limited to laser groove / ablation, mechanical dicing, stealth dicing.
- Collaborate with cross-functional teams to drive innovation and integrate new process technologies.
- Design and conduct experiments to develop and refine packaging processes.
- Analyze experimental data to identify trends and optimize process parameters.
- Develop comprehensive process documentation and control plans.
- Address and resolve complex process-related challenges.
- Stay abreast of the latest advancements in semiconductor packaging and incorporate cutting-edge techniques.
- Mentor and provide technical leadership to junior engineers and team members.
- Ensure all R&D activities comply with industry standards and company policies.
Requirements:
- Education
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- Experience
- Minimum of 5 years of experience in semiconductor package assembly process development.
- Experience in Project Management is a plus.
- Skills
- In-depth knowledge of wafer singulation processes, semiconductor packaging technologies and materials.
- Proven track record in process development and efficient use of methodologies.
- Strong analytical and problem-solving skills.
- Excellent communication and collaboration abilities.
- Familiar with Project Management concepts and tools.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
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